Nano-silica is one of the most important high-tech ultra-fine inorganic new materials. Due to its small particle size, it has a large specific surface area, strong surface adsorption capacity, high surface energy, high chemical purity, excellent dispersion performance, and unique properties in thermal resistance and electrical resistance. With its superior stability, reinforcement, thickening and thixotropy, it has unique characteristics and irreplaceable functions in many disciplines and fields. Commonly known as "ultra-fine silica", nano-silica is widely used in various industries as additives, catalyst carriers, petrochemical products, decolorizers, matting agents, rubber reinforcing agents, plastic fillers, ink thickeners, metal soft polishing agents, insulating and heat-insulating fillers, advanced daily cosmetic fillers, as well as spraying materials, medicine, environmental protection and other fields. It provides a new material basis and technical guarantee for the development of related industrial fields. Compared with conventional materials, it exhibits special functions in magnetism, catalytic activity, optical absorption, thermal resistance and melting point, thus attracting great attention.
Electronic Packaging Materials
Organic Electroluminescent Devices (OELD) are a new type of flat panel display device newly developed. They have the advantages of low turn-on and driving voltage, DC voltage drive, compatibility with large-scale integrated circuits, easy full-color realization, and high luminous brightness (>105cd/m²). However, the service life of OELD devices cannot meet the application requirements yet. One of the technical difficulties to be solved is the packaging materials and packaging technology of the devices. At present, foreign countries (Japan, the United States, Europe, etc.) widely use silicone-modified epoxy resin. Through blending, copolymerization or grafting reaction between the two, it can not only reduce the internal stress of epoxy resin but also form intramolecular toughening and improve high-temperature resistance, and also improve the waterproof, oil-proof and oxidation resistance of silicone. However, it requires a long curing time (from several hours to several days). To accelerate the curing reaction, a higher temperature (60℃ to above 100℃) or an increased amount of curing agent is required, which not only increases the cost but also makes it difficult to meet the requirements of large-scale device production lines for packaging materials (short time, room temperature packaging). Fully dispersing nano-silica after surface activation treatment in the silicone-modified epoxy resin encapsulant matrix can greatly shorten the curing time of packaging materials (2.0-2.5h), and the curing temperature can be reduced to room temperature, significantly improving the sealing performance of OELD devices and increasing their service life.